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CoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics. We help you design a thick-film ceramic substrate tailored to your application:Get more news about Alumina Ceramic Substrate,you can vist our website!

Alumina is the material of choice for most thick-film ceramic substrates — delivering durable, cost-effective performance for hybrid electronic circuits with proven reliability. CoorsTek has engineered different grades, formulations, and thicknesses to provide an optimal fit for a variety of applications.

CoorsTek offers special differential scribing to enhance preferential singulation. By varying the laser pulse spacing and depth in the (x) and (y) scribe directions, the sequence of singulation is controlled more precisely. Enhanced laser scribing helps prevent hooking, chipping, and premature breakage — improving process yields. Our Design Guide provides typical scribe line configurations and tolerances.

Alumina is the most commonly used technical ceramic material. Thanks to its very good electrical insulation, dielectric strength, and high-temperature resistance up to 1500 °C, Alumina Ceramic is ideal for electrical applications and high-temperature applications.